Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the same

ABSTRACT

A system for transfer of a plurality of die from a die source to a receive substrate is provided. The system includes a die source including a plurality of die, the plurality of die being coupled to a carrier. The system also includes a receive substrate to receive the plurality of die from the die source. The receive substrate includes a die catch material for receiving the plurality of die from the die source, the die catch material being reusable. The system also includes a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.63/081,522, filed Sep. 22, 2020, and U.S. Provisional Application No.63/081,861, filed Sep. 22, 2020, the content of both of which isincorporated herein by reference.

FIELD

The invention relates to systems and methods for transfer of die, and inparticular, to improved systems and methods for transferring die usingreusable materials.

BACKGROUND

In the semiconductor assembly and manufacturing industry, die placementand transfer utilizes a number of different technologies. One exampletype of die are LED (e.g., light emitting diode) die. Such LED die maybe used in connection with the assembly and manufacture of various typesof displays.

Exemplary technologies related to die transfer (including LED dietransfer, and/or laser based transfer) are disclosed in the followingpatent documents, each of which is incorporated by reference herein:U.S. Pat. No. 9,862,141 (entitled “SELECTIVE LASER-ASSISTED TRANSFER OFDISCRETE COMPONENTS”); U.S. Pat. No. 10,748,802 (entitled “PLACINGULTRA-SMALL OR ULTRA-THIN DISCRETE COMPONENTS”); U.S. Patent ApplicationPublication No. 2020/0168498 (entitled “PARALLEL ASSEMBLY OF DISCRETECOMPONENTS ONTO A SUBSTRATE”); International Publication No. WO2020/252161 (entitled “MATERIAL FOR POSITIONAL ERROR COMPENSATION INASSEMBLY OF DISCRETE COMPONENTS”); International Publication No. WO2020/252164 (entitled “POSITIONAL ERROR COMPENSATION IN ASSEMBLY OFDISCRETE COMPONENTS BY ADJUSTMENT OF OPTICAL SYSTEM CHARACTERISTICS”);International Publication No. WO 2020/168174 (entitled “DYNAMIC RELEASETAPES FOR ASSEMBLY OF DISCRETE COMPONENTS”); and InternationalPublication No. WO 2021/126580 (entitled “ADHESIVE TAPES FOR RECEIVINGDISCRETE COMPONENTS”).

Unfortunately, the transfer and/or placement of certain die (e.g., LEDdie, mini LED die, micro LED die, etc.), in particular in laser assistedtransfer applications, involves a number of complexities (e.g., costs,efficiency, repeatability, etc.). Such complexities often relate tomaterials (e.g., consumable materials) used in the transfer processes.

Thus, it would be desirable to provide improved systems and methods fortransferring die from a die source to a receive substrate, and improvedmaterials used in connection with the same.

SUMMARY

According to an exemplary embodiment of the invention, a system fortransfer of a plurality of die from a die source to a receive substrateis provided. The system includes a die source including a plurality ofdie, the plurality of die being coupled to a carrier. The system alsoincludes a receive substrate to receive the plurality of die from thedie source, the receive substrate including a die catch material forreceiving the plurality of die from the die source, the die catchmaterial being reusable. The system also includes a laser source forproviding energy to interact with a die release material to transfer theplurality of die from the die source to the receive substrate.

According to another exemplary embodiment of the invention, a method oftransferring a plurality of die from a die source to a receive substrateis provided. The method includes the steps of: (a) coupling a pluralityof die to a carrier by a die release material, thereby assembling a diesource; and (b) applying energy to the die release material using alaser to transfer the plurality of die from the die source to a receivesubstrate. The receive substrate includes a die catch material forreceiving the die from the die source, the die catch material beingreusable.

According to yet another exemplary embodiment of the invention, a systemfor transfer of a plurality of die from a die source to a receivesubstrate is provided. The system includes a die source including aplurality of die, the plurality of die being coupled to a carrier by adie release material. At least a portion of the die release material isreusable. The system also includes a receive substrate to receive theplurality of die from the die source. The system also includes a lasersource for providing energy to interact with the die release material totransfer the plurality of die from the die source to the receivesubstrate.

According to yet another exemplary embodiment of the invention, a methodof transferring a plurality of die from a die source to a receivesubstrate is provided. The method includes the steps of: (a) coupling aplurality of die to a carrier via a die release material, therebyassembling a die source, at least a portion of the die release materialbeing reusable; and (b) applying energy to the die release materialusing a laser to transfer the plurality of die from the die source to areceive substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is best understood from the following detailed descriptionwhen read in connection with the accompanying drawings. It is emphasizedthat, according to common practice, the various features of the drawingsare not to scale. On the contrary, the dimensions of the variousfeatures are arbitrarily expanded or reduced for clarity. Included inthe drawings are the following figures:

FIGS. 1A-1B are block diagram side views illustrating coupling of aplurality of die to a carrier, and coupling of a die catch material to areceive substrate, in accordance with an exemplary embodiment of theinvention;

FIGS. 1C-1D are block diagram side views illustrating transfer of theplurality of die from the carrier of FIG. 1B to the receive substrate,in accordance with an exemplary embodiment of the invention;

FIGS. 2A-2F are a series of block diagram side views illustratingtransfer of the plurality of die from the receive substrate of FIG. 1Dusing a pick tool, and reuse of the receive substrate, in accordancewith an exemplary embodiment of the invention;

FIGS. 3A-3E are a series of block diagram side views illustratingtransfer of the plurality of die from the receive substrate of FIG. 1Dusing another pick tool, and reuse of the receive substrate, inaccordance with an exemplary embodiment of the invention;

FIGS. 4A-4E are a series of block diagram side views illustratingtransfer of the plurality of die from the receive substrate of FIG. 1Dusing an adhesive substrate, and reuse of the receive substrate, inaccordance with an exemplary embodiment of the invention;

FIGS. 5A-5E are a series of block diagram side views illustratingremoval of the plurality of die from an energy absorbing portion of thereceive substrate by removing an adhesive portion (e.g., a tape, a film,etc.) of the receive substrate, and reuse of the energy absorbingportion of the receive substrate, in accordance with an exemplaryembodiment of the invention;

FIGS. 6A-6B are a series of block diagram side views illustratingassembly of a die source including a die release material in accordancewith an exemplary embodiment of the invention;

FIGS. 6C-6E are a series of block diagram side views illustratingtransfer of a plurality of die from the die source of FIG. 6B to areceive substrate, in accordance with an exemplary embodiment of theinvention;

FIG. 6F is a block diagram side view illustrating separation of (i) atape of the die source (the tape previously carrying the plurality ofdie) from (ii) the die release material of the die source, in accordancewith an exemplary embodiment of the invention;

FIGS. 6G-6H are a series of block diagram side views illustratingassembly of another die source including the die release material ofFIGS. 6A-6F, in accordance with an exemplary embodiment of theinvention;

FIGS. 6I-6J are a series of block diagram side views illustratingtransfer of a plurality of die from the die source of FIG. 6H to areceive substrate, in accordance with an exemplary embodiment of theinvention; and

FIGS. 7A-7B are side views of block diagrams illustrating die sourceswith example die release materials in accordance with various exemplaryembodiments of the invention.

DETAILED DESCRIPTION

According to certain exemplary embodiments of the invention, in a dietransfer process, die are transferred from a die source to a receivesubstrate (e.g., a target carrier). As used herein, the term “die” shallbe broadly defined to include any type of semiconductor element, or anycomponent including such a semiconductor element. Exemplary die includelight emitting diodes (i.e., LEDs), mini LEDS, micro LEDs, etc.

In certain example applications, a plurality of die are mounted on acarrier using a die release material. The die release material isactivated by energy (e.g., a pulse, a laser beam, etc.) from a lasersource in connection with a laser based transfer process. The die isreleased from the die release material, flies through the air and iscaught on the receive substrate by die catch material (sometimes calleddie catching material) mounted on a base substrate (i.e., targetcarrier). The die catch material serves to absorb the energy from theflying die, hold the die in the caught position, and (if desired)release the die in subsequent transfer processes. As used herein, a“transfer process” (sometimes referred to as a die transfer process ortransfer mechanism) means a process which moves a die from one substrateto another (e.g., from a die source to a receive substrate). A laserbased transfer process (e.g., which may also be referred to as a laserassisted transfer process) may include a number of processes, includingat least one of an ablative process, a blistering process, a thermalrelease process, and/or a surface morphology change process. Aspects ofthis invention relate to a die catch material which is reusable formultiple transfer processes. Other aspects relate to a die releasematerial (e.g., reusable adhesive material) included as part of the diesource, where the die release material is at least partially reusablefor multiple transfer processes.

As used herein, the term “reusable”, in the context of a reusable diecatch material or a reusable die release material, is intended to referto a characteristic in which a material may be used in more than onetransfer process (e.g., a laser transfer process). In certainapplications, only a portion of the die catch material or the dierelease material may be reusable. A reusable material lowers materialcosts, complexities, and other related costs associated with reapplyingdie catch material or die release material (e.g., a dynamic releaselayer) for multiple transfers.

Existing transfer processes describe the die catch material as beingsingle use and needing to be reapplied after each use. In accordancewith exemplary aspects the invention, the material is specificallydesigned to be used multiple times, which reduces process complexity andcost.

As used herein, the term “carrier” is intended to refer to any structurewhich carries a plurality of die (directly or indirectly) in connectionwith a die transfer process. Exemplary carriers include: a rigidsubstrate; a glass substrate; a laser transparent substrate; a flexiblefreestanding carrier; and/or other freestanding structures used totransport substrates and/or die. Freestanding structures (such ascarriers and/or freestanding dynamic release tapes) are described inInternational Publication Number WO 2020/168174 (entitled “DYNAMICRELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS”), the content ofwhich is incorporated herein by reference. As used herein, the term “diecatch material” is intended to refer to a material which is used toreceive a die during a transfer process. A die catch material mayinclude at least one of: a homogenous material; a heterogenous material;a multi-layered material; an adhesive material; an energy absorbingmaterial; and/or a kinetic energy absorbing material.

Throughout the present application die catch materials and die releasematerials are described. An example structure of a die release materialincludes: a base layer (e.g., a PET material); a laser absorption layer(e.g. a polyimide material); and a blistering layer and an adhesivelayer (where the blistering layer and the adhesive layer could be 2distinct layers, or could be a single layer of material that serves bothfunctions). An example structure of a die catch material includes: abase layer (e.g., a PET material); an energy absorbing layer (e.g. aBingham plastic); and an adhesive layer.

Referring now to FIGS. 1A-1D, a series of block diagram side views ofsystems for transfer of die (and related methods) is illustrated. InFIG. 1A, a plurality of die 108 have been attached to a die releasematerial 110. Die release material 110 may include any structure asdesired in the given application. For example, die release material 110may include at least one of an adhesive layer and a reactive layer (notshown for simplicity). Also shown in FIG. 1A are a die catch material120, a carrier 130, and a base substrate 140.

In FIG. 1B, the plurality of die 108 have been coupled to carrier 130using die release material 110, thereby assembling a die source 134. Itshall be understood that additional layers or materials may be includedin die source 134 in addition to those illustrated. For example, theplurality of die 108 may be carried by a tape (such as a wafer tape, adie bonding tape, etc.) before being secured to die release material110.

Likewise, die catch material 120 has been coupled to base substrate 140,thereby assembling a receive substrate 144.

As used herein, the terms “coupled” or “coupling” refer to any type ofattachment between more than one element, whether the attachment isdirect or indirect. For example, two elements may be coupled togethervia another element. In another example, two elements may be coupledtogether with an intermediate element (or multiple intermediateelements) provided therebetween.

FIG. 1C illustrates a system 100 for transfer of the plurality of die108 from die source 134 to receive substrate 144. In addition to diesource 134 and receive substrate 144, system 100 includes laser source150. Laser source 150 provides energy 150 a (e.g., a laser beam) throughcarrier 130 to transfer die 108 from die source 134 to die catchmaterial 120. Although FIG. 1C illustrates the transfer of a single die108, it is understood that the plurality of die 108 may be transferredone at a time, or with multiple of the plurality of die 108 beingtransferred simultaneously. The transfer process may include at leastone of a number of processes, including an ablative process, ablistering process, a thermal release process, and/or a surfacemorphology change process (e.g., on a surface of an adhesive layer). Asillustrated in FIG. 1D, all of the die 108 have now been transferredfrom die source 134 to receive substrate 144. As such, the plurality ofdie 108 (now on receive substrate 144) are prepared for a subsequenttransfer operation.

Each of FIGS. 2A-2F, FIGS. 3A-3E, FIGS. 4A-4E, and FIGS. 5A-E illustratean exemplary subsequent transfer operation transferring the plurality ofdie 108 away from receive substrate 144. Regardless of the subsequenttransfer operation used, after the plurality of die 108 have beentransferred from receive substrate 144, in accordance with aspects ofthe invention, receive substrate 144 (including die catch material 120)is reusable.

Referring now to FIGS. 2A-2F, a transfer of the plurality of die 108away from receive substrate 144 (e.g., to another substrate), and thesubsequent reuse of the die catch material 120, is illustrated. In FIG.2A, receive substrate 144 (from FIG. 1D) is illustrated with a pluralityof die 108. A pick tool 202 (e.g., a pick-and-place tool, or anothercomponent transfer tool) is illustrated above receive substrate 144prior to a transfer operation. In FIG. 2B, pick tool 202 has been movedtoward receive substrate 144 until pick tool 202 makes contact with adie 108—so that pick tool 202 can move the die 108 away from receivesubstrate 144. In FIG. 2C, pick tool 202 is illustrated transferring(i.e., “picking”) a last die 108 from receive substrate 144. In FIG. 2D,receive substrate 144 is illustrated without the plurality of die 108(i.e., all of the plurality of die 108 having been removed by pick tool202), in preparation for another transfer. In FIG. 2E, another diesource 134′ is positioned above receive substrate 144, in preparationfor another die transfer process. Die source 134′ includes a pluralityof die 108′ coupled to carrier 130 using die release material 110′.

FIG. 2F illustrates a system 100′ for transfer of the plurality of die108′ from die source 134′ to receive substrate 144. In addition to diesource 134′ and receive substrate 144, system 100′ includes laser source150. Laser source 150 provides energy 150 b (e.g., a laser beam) throughcarrier 130 to transfer die 108′ from die source 134′ to receivesubstrate 144. FIG. 2F illustrates the leftmost die 108′ having beentransferred from die source 134′ to receive substrate 144 (specificallythe top surface of die catch material 120). Thus, die catch material 120of receive substrate 144 has been reused in this transfer process.

Referring now to FIGS. 3A-3E, a transfer of the plurality of die 108away from receive substrate 144 (e.g., to another substrate), and thesubsequent reuse of the die catch material 120, is illustrated. In FIG.3A, receive substrate 144 (from FIG. 1D) is illustrated with a pluralityof die 108. Another pick tool 302 (e.g., a pick-and-place tool formulti-die transfer, a PDMS stamp, etc.) is illustrated above receivesubstrate 144 prior to a transfer operation. In FIG. 3B, pick tool 302has been moved toward receive substrate 144 until pick tool 302 makescontact with a plurality of die 108—so that pick tool 302 can move theplurality of die 108 away from receive substrate 144. In FIG. 3C, picktool 302 is illustrated transferring (i.e., “picking”) the plurality ofdie 108 from receive substrate 144. In FIG. 3D, receive substrate 144 isillustrated without the plurality of die 108 (i.e., the plurality of die108 having been removed by pick tool 302), in preparation for anothertransfer. Another die source 134′ is positioned above receive substrate144, in preparation for another die transfer process. Die source 134′includes a plurality of die 108′ coupled to carrier 130 using dierelease material 110′.

FIG. 3E illustrates system 100′ for transfer of the plurality of die108′ from die source 134′ to receive substrate 144. FIG. 3E illustratesthe leftmost die 108′ having been transferred from die source 134′ toreceive substrate 144 (specifically the top surface of die catchmaterial 120). Thus, die catch material 120 of receive substrate 144 hasbeen reused in this transfer process.

Referring now to FIGS. 4A-4E, a transfer of the plurality of die 108away from receive substrate 144 (e.g., to another substrate), and thesubsequent reuse of the die catch material 120, is illustrated. In FIG.4A, receive substrate 144 (from FIG. 1D) is illustrated with a pluralityof die 108. A wafer ring 132 is illustrated positioned above receivesubstrate 144. An adhesive substrate 112 (e.g., dicing tape) is attachedto wafer ring 132. In FIG. 4B, wafer ring 132 has been moved towardreceive substrate 144 until adhesive substrate 112 makes contact withthe plurality of die 108. In FIG. 4C, wafer ring 132 and adhesivesubstrate 112 have been moved away from receive substrate 144. Adhesivesubstrate 112, having a stronger adhesive property than die catchmaterial 120, has lifted the plurality of die 108 after the wafer ring132 was moved away from receive substrate 144. Receive substrate 144 isillustrated without the plurality of die 108 (i.e., the plurality of die108 having been removed by adhesive substrate 112), in preparation foranother transfer. In FIG. 4D, another die source 134′ is positionedabove receive substrate 144, in preparation for another die transferprocess.

FIG. 4E illustrates system 100′ for transfer of the plurality of die108′ from die source 134′ to receive substrate 144. The leftmost die108′ is illustrated having been transferred from die source 134′ toreceive substrate 144 (specifically the top surface of die catchmaterial 120). Thus, die catch material 120 of receive substrate 144 hasbeen reused in this transfer process.

It will be appreciated by those skilled in the art that a different typeof transfer structure (including an adhesive) could be utilized insteadof a wafer ring in FIGS. 4A-4C. That is, wafer ring 132 is simply anexample of such a transfer structure including an adhesive (i.e.,adhesive substrate 112). In any case, the transfer structure shouldinclude (or use) an adhesive property that can remove the plurality ofdie from receive substrate 144.

Referring now to FIGS. 5A-5E, a transfer of the plurality of die 108away from receive substrate 544 (e.g., to another substrate), and thesubsequent reuse of an energy absorbing portion 520 a of a die catchmaterial 520, is illustrated. In FIG. 5A, receive substrate 544 (e.g.,similar to receive substrate 144 from FIG. 1D) is illustrated with theplurality of die 108. Receive substrate 544 includes die catch material520 on a base substrate 140, where die catch material 520 includesenergy absorbing portion 520 a and an adhesive portion 520 b (e.g., atape, a film, an adhesive layer, etc.). In FIG. 5B, adhesive portion 520b is removed from energy absorbing portion 520 a, thereby removing theplurality of die 108 from receive substrate 544. Adhesive portion 520 bmay be removed using any of a number of techniques such as manualremoval (e.g., peeling), automatic removal, etc. In FIG. 5C, anotheradhesive portion 520 b′ has been coupled to energy absorbing portion 520a, thereby assembling receive substrate 544′. In FIG. 5D, another diesource 134′ is positioned above receive substrate 544′, in preparationof another die transfer process.

FIG. 5E illustrates a system 100″ (which is substantially similar topreviously described system 100′) for transfer of the plurality of die108′ from die source 134′ to receive substrate 544′. The leftmost die108′ has been transferred from die source 134′ to receive substrate 544′(specifically the top surface of adhesive portion 520 b′). Thus, energyabsorbing portion 520 a has been reused in this transfer process.

FIGS. 1A-1D, FIGS. 2A-2F, FIGS. 3A-3E, FIGS. 4A-4E, and FIGS. 5A-5Eillustrate various exemplary aspects of the invention related toapplications involving a reusable die match material. However,additional aspects of the invention relate to a reusable (or at leastpartially reusable) die release material. FIGS. 6A-6J and FIGS. 7A-7Brelate to applications involving such a reusable die release material.

Referring specifically to FIG. 6A, a tape 614 (e.g., a wafer tape, a diebonding tape, etc.) carrying a plurality of die 608 is illustrated inthe process of being coupled to a die release material 610 on a carrier630, thereby assembling a die source 634 (see FIG. 6B). Morespecifically, die source 634 includes the plurality of die 608indirectly coupled to carrier 630 using die release material 610 andtape 614. As shown in FIG. 6B, a receive substrate 644 (including a diecatch material 620 and a base substrate 640) is positioned beneath diesource 634, in preparation for a transfer process. FIG. 6C illustrates asystem 600 for transfer of a plurality of die 608 from die source 634 toreceive substrate 644. System 600 includes die source 634, receivesubstrate 644, and a laser source 650. Laser source 650 provides energy650 a (e.g., a laser beam) to interact with die release material 610 totransfer the plurality of die 608 from die source 634 to receivesubstrate 644. In FIG. 6D, one of the plurality of die 608 has beentransferred from die source 634 (more specifically from tape 614) toreceive substrate 644 (more specifically to the surface of die catchmaterial 620 facing die source 634). FIG. 6D illustrates a transferprocess including “blistering”. However, is is understood that thetransfer processes may include one or more of the following aspects: ablistering process; an ablative process; a thermal release process; anda surface morphology change process (e.g., changing a surface of the dierelease material 610 adjacent the respective die 608).

Regarding the blistering process shown in FIG. 6D, energy 650 a(provided by laser source 650) is transmitted through carrier 630 to anarea 610 a of die release material 610. The interaction of energy 650 aand die release material 610 (which may include a reactive layer ormaterial for interacting with energy 650 a) results in a gas 610 b beinggenerated. Pressure from the generation of gas 610 b results in theformation of a blister 614 a. As will be understood by those skilled inthe art, area 610 a may be partially ablated (as illustrated in FIG. 6D)in connection with the transfer process. Die 608 is thereaftertransferred by blister 614 a to receive substrate 634, as illustrated.Details of exemplary blistering transfer processes are described in U.S.Pat. No. 9,862,141 (entitled “SELECTIVE LASER-ASSISTED TRANSFER OFDISCRETE COMPONENTS”).

In FIG. 6E, all of the plurality of die 608 have been transferred. InFIG. 6F, tape 614 is illustrated being removed (i.e., decoupled) fromdie release material 610. Tape 614 is subsequently discarded. In FIG.6G, another tape 614′ (e.g., a wafer tape, carrying a plurality of die608′) is coupled to die release material 610, thereby indirectlycoupling the plurality of die 608′ to carrier 630. In FIG. 6H, dierelease material 610 is reused in creating another die source 634′(including the plurality of die 608′ and carrier 630). Die source 634′is positioned above receive substrate 644′ (including another die catchmaterial 620′ and another base substrate 640′) in preparation foranother transfer process. In FIG. 6I, a system 600′ for transfer of theplurality of die 608′ from die source 634′ to receive substrate 644′ isillustrated. System 600′ includes die source 634′, receive substrate644′, and laser source 650. Die release material 610 is being reused inanother transfer process. Laser source 650 is illustrated transmittingenergy 650 b in connection with a transfer process. In FIG. 6J, anotherblistering process is illustrated, although a number of transferprocesses may be used (including an ablative process, a thermal releaseprocess, and a surface morphology change process for the surface). Afterenergy 650 b is transmitted through carrier 630 to a portion 610 a ofdie release material 610 (including, for example, a reactivelayer/portion), gas 610 b is generated, consequently building pressureon surface 610 a to form a blister 614′a. Another die 608′ (specificallythe leftmost die 608′) has been transferred by blister 614′a to receivesubstrate 644′.

As will be appreciated by those skilled in the art, a structure of a dierelease material used in connection with the present invention may varydepending on the specific application and requirements. Thus, there isnot a single structure for die release material 610 shown in FIGS.6A-6J. FIGS. 7A-7B illustrate exemplary die release materials 610 a and610 b, which could be used as die release material 610 in FIGS. 6A-6J(and further could be used as die release materials 110, 110′ in theprior drawings). Of course, other structures of die release material 610(or die release materials 110, 110′) are contemplated.

Referring specifically to FIG. 7A, the plurality of die 608 areillustrated indirectly coupled to carrier 630 through a die releasematerial 610 a (and tape 614), thereby assembling die source 634 a. Dierelease material 610 a includes a base layer 610 a 1 and a reactivelayer 610 a 2 (e.g., an ablation layer, a blistering layer, a gasforming layer, etc.). Tape 614 may also be used as a blistering layer.Die release material 610 a optionally includes an adhesive layer 610 aafor adhering die release material 610 a to carrier 630; however, such anadhesive may be provided directly on carrier 630 (and not as part of dierelease material 610 a).

In FIG. 7B, the plurality of die 608 are illustrated coupled to tape614. Tape 614 is coupled to carrier 630 through a die release material610 b, thereby forming die source 634 b. Die release material 610 bincludes a base layer 610 b 1, a reactive layer 610 b 2 (e.g., anablation layer, a blistering layer, a gas forming layer, etc.), and anadhesive layer 610 b 3. Die release material 610 b optionally includesan adhesive layer 610 bb for adhering die release material 610 a tocarrier 630; however, such an adhesive may be provided directly oncarrier 630 (and not as part of die release material 610 b).

Although the embodiments of the invention discussed thus far relateprincipally to transfer processes using either of a reusable die catchmaterial or a reusable die release material, the invention is not solimited. For example a process involving the use of both a reusable diecatch material and a usable die release material is contemplated. Thus,the die catch material of any of FIGS. 2A-2F, FIGS. 3A-3E, FIGS. 4A-4E,and/or FIGS. 5A-5E (or any other reusable die catch material within thescope of the invention) may be combined with the die release material ofFIGS. 6A-6J and/or FIG. 7A-7B (or any other reusable die releasematerial within the scope of the invention) in connection with a system(or method) for transferring a plurality of die from a die source to areceive substrate.

Four additional exemplary embodiments of the invention are recitedbelow.

In a first additional embodiment, a system for transfer of die from asource to a receive substrate is provided. The system includes a diesource including a plurality of die attached to a flexible film. Thesystem also includes a carrier including a reactive layer and anadhesive layer. The die source is coupled to the adhesive layer suchthat the flexible film is in contact with the adhesive layer. The systemalso includes a receive substrate to receive the die from the diesource, and a laser source for providing energy to interact with thereactive layer to transfer the plurality of die from the die source tothe receive substrate. In such a first additional embodiment, a numberof additional exemplary aspects include, for example: the flexible filmis a wafer tape or a die bonding tape; the reactive layer and theadhesive layer are both included in a tape included as part of thecarrier; the transfer of the plurality of die from the die source to thereceive substrate is configured to occur one die at a time; the transferof the plurality of die from the die source to the receive substrate isconfigured to occur multiple die at a time; the transfer mechanism(i.e., transfer process) for transferring the plurality of die from thedie source to the receive substrate includes at least one of an ablativeprocess, a blistering process, a thermal release process, and a surfacemorphology change process for the surface of the adhesive layer; theplurality of die are LED die; the carrier includes a laser transmissivesubstrate for supporting the reactive layer and the adhesive layer; andthe carrier is a flexible freestanding carrier including the reactivelayer and the adhesive layer.

In a second additional embodiment, a method of transferring a pluralityof die from a die source to a receive substrate is provided. The methodincludes the steps of: (a) coupling (i) a die source including aplurality of die attached to a flexible film to (ii) an adhesive layerof a carrier, the carrier also including a reactive layer; and (b)applying energy to the reactive layer using a laser to transfer theplurality of die from the die source to the receive substrate. In such asecond additional embodiment of the invention, a number of additionalexemplary aspects include, for example: the flexible film is a wafertape or a die bonding tape; the reactive layer and the adhesive layerare both included in a tape included as part of the carrier; thetransfer of the plurality of die from the die source to the receivesubstrate is configured to occur one die at a time; the transfer of theplurality of die from the die source to the receive substrate isconfigured to occur multiple die at a time; a transfer mechanism (i.e.,transfer process) for transferring the plurality of die from the diesource to the receive substrate includes at least one of an ablativeprocess, a blistering process, a thermal release process, and a surfacemorphology change process for the surface of the adhesive layer; theplurality of die are LED die; the carrier includes a laser transmissivesubstrate for supporting the reactive layer and the adhesive layer;and/or the carrier is a flexible freestanding carrier including thereactive layer and the adhesive layer.

In a third additional embodiment, another system for transfer of diefrom a source to a receive substrate is provided. The system includes aplurality of die coupled to a carrier, the carrier including a reactivelayer and an adhesive layer. The system also includes a receivesubstrate to receive the die from the die source, the receive substrateincluding a first adhesive layer adhered to a receive carrier, and asecond adhesive layer adhered to the first adhesive layer. The systemalso includes a laser source for providing energy to interact with thereactive layer to transfer the plurality of die from the die source tothe receive substrate. In such a third additional embodiment, a numberof additional exemplary aspects include, for example: the plurality ofdie are secured to a flexible film, and the flexible film is coupled tothe adhesive layer of the carrier; the plurality of die are secured tothe adhesive layer of the carrier; the transfer of the plurality of diefrom the die source to the receive substrate is configured to occur onedie at a time; wherein transfer of the plurality of die from the diesource to the receive substrate is configured to occur multiple die at atime; a transfer mechanism (i.e., transfer process) for transferring theplurality of die from the die source to the receive substrate includesat least one of an ablative process, a blistering process, a thermalrelease process, and a surface morphology change process for the surfaceof the adhesive layer; the plurality of die are LED die; wherein thecarrier includes a laser transmissive substrate for supporting thereactive layer and the adhesive layer; the carrier is a flexiblefreestanding carrier including the reactive layer and the adhesivelayer; the second adhesive layer is configured to be removed from thereceive substrate, along with ones of the plurality of die transferredto the receive substrate, for subsequent processing. wherein at leastone of the first adhesive layer and the second adhesive layer is a tapebased adhesive layer; the first adhesive layer is a material design toabsorb the energy of the die landing on the second adhesive layer; thefirst adhesive layer is a gel based adhesive layer, and the secondadhesive layer is a tape based adhesive layer (wherein the gel basedadhesive layer is a Bingham fluid or plastic fluid; and/or wherein thetape based adhesive layer is a wafer tape or a die bonding tape).

In a fourth additional embodiment, a method of transferring a pluralityof die from a die source to a receive substrate is provided. The methodincludes the steps of: (a) coupling a plurality of die to an adhesivelayer of a carrier, the carrier also including a reactive layer; and (b)applying energy to the reactive layer using a laser to transfer theplurality of die from the die source to the receive substrate, thereceive substrate including a first adhesive layer adhered to a receivecarrier, and a second adhesive layer adhered to the first adhesivelayer. In such a fourth additional embodiment of the invention, a numberof additional exemplary aspects include, for example: the plurality ofdie are LED die; the transfer of the plurality of die from the diesource to the receive substrate is configured to occur one die at atime; transfer of the plurality of die from the die source to thereceive substrate is configured to occur multiple die at a time; atransfer mechanism (i.e., transfer process) for transferring theplurality of die from the die source to the receive substrate includesat least one of an ablative process, a blistering process, a thermalrelease process, and a surface morphology change process for the surfaceof the adhesive layer; the plurality of die are secured to a flexiblefilm, and the flexible film is coupled to the adhesive layer of thecarrier. wherein the flexible film is a wafer tape; the plurality of dieare secured to the adhesive layer of the carrier; the at least one ofthe first adhesive layer and the second adhesive layer is a tape basedadhesive layer; the first adhesive layer is a material design to absorbthe energy of the die landing on the second adhesive layer; the firstadhesive layer is a gel based adhesive layer, and the second adhesivelayer is a tape based adhesive layer; the gel based adhesive layer is aBingham fluid or plastic fluid; and/or the tape based adhesive layer isa wafer tape or a die bonding tape.

Although the invention is illustrated and described herein withreference to specific embodiments, the invention is not intended to belimited to the details shown. Rather, various modifications may be madein the details within the scope and range of equivalents of the claimsand without departing from the invention.

What is claimed:
 1. A system for transfer of a plurality of die from adie source to a receive substrate, the system comprising: a die sourceincluding a plurality of die, the plurality of die being coupled to acarrier; a receive substrate to receive the plurality of die from thedie source, the receive substrate including a die catch material forreceiving the plurality of die from the die source, the die catchmaterial being reusable; and a laser source for providing energy tointeract with a die release material to transfer the plurality of diefrom the die source to the receive substrate.
 2. The system of claim 1wherein the plurality of die are secured to a wafer tape, and theplurality of die are coupled to the carrier indirectly using the wafertape.
 3. The system of claim 1 wherein the plurality of die are coupledto the carrier using the die release material.
 4. The system of claim 1wherein more than one of the plurality of die are transferred from thedie source to the receive substrate simultaneously.
 5. The system ofclaim 1 wherein a transfer process for transferring the plurality of diefrom the die source to the receive substrate includes at least one of anablative process, a blistering process, a thermal release process, and asurface morphology change process for a surface of the die releasematerial.
 6. The system of claim 1 wherein the carrier includes a lasertransmissive substrate for supporting the die release material.
 7. Amethod of transferring a plurality of die from a die source to a receivesubstrate, the method comprising the steps of: (a) coupling a pluralityof die to a carrier via a die release material, thereby assembling a diesource; and (b) applying energy to the die release material using alaser to transfer the plurality of die from the die source to a receivesubstrate, the receive substrate including a die catch material forreceiving the plurality of die from the die source, the die catchmaterial being reusable.
 8. The method of claim 7 further comprising thesteps of (c) transferring the plurality of die from the receivesubstrate to another substrate; and (d) reusing the receive substrate,including the die catch material, for another die transfer.
 9. Themethod of claim 7 wherein the plurality of die are secured to a wafertape, and the plurality of die are coupled to the carrier indirectlyusing the wafer tape.
 10. The method of claim 7 wherein transfer of theplurality of die from the die source to the receive substrate isconfigured to occur multiple die at a time.
 11. The method of claim 7wherein a transfer process for transferring the plurality of die fromthe die source to the receive substrate includes at least one of anablative process, a blistering process, a thermal release process, and asurface morphology change process for a surface of the die releasematerial.
 12. A system for transfer of a plurality of die from a diesource to a receive substrate, the system comprising: a die sourceincluding a plurality of die, the plurality of die being coupled to acarrier using a die release material, at least a portion of the dierelease material being reusable; a receive substrate to receive theplurality of die from the die source; and a laser source for providingenergy to interact with the die release material to transfer theplurality of die from the die source to the receive substrate.
 13. Thesystem of claim 12 wherein the plurality of die are secured to a wafertape, and the plurality of die are coupled to the carrier indirectlyusing the wafer tape.
 14. The system of claim 13 wherein the wafer tapeis adhered to the die release material of the carrier to indirectlycouple the plurality of die to the carrier.
 15. The system of claim 12wherein the transfer of the plurality of die from the die source to thereceive substrate is configured to occur multiple die at a time.
 16. Thesystem of claim 12 wherein a transfer process for transferring theplurality of die from the die source to the receive substrate includesat least one of an ablative process, a blistering process, a thermalrelease process, and a surface morphology change process for a surfaceof the die release material.
 17. The system of claim 12 wherein thecarrier includes a laser transmissive substrate for supporting the dierelease material.
 18. The system of claim 12 wherein the carrier is aflexible freestanding carrier.
 19. A method of transferring a pluralityof die from a die source to a receive substrate, the method comprisingthe steps of: (a) coupling a plurality of die to a carrier via a dierelease material, thereby assembling a die source, at least a portion ofthe die release material being reusable; and (b) applying energy to thedie release material using a laser to transfer the plurality of die fromthe die source to a receive substrate.
 20. The method of claim 19further comprising the step of (c) securing another die source includinganother plurality of die to the carrier using the die release material.21. The method of claim 19 wherein the plurality of die are secured to awafer tape, and the plurality of die are coupled to the carrierindirectly using the wafer tape.
 22. The method of claim 21 wherein thewafer tape is adhered to the die release material of the carrier toindirectly couple the plurality of die to the carrier.
 23. The method ofclaim 19 wherein the transfer of the plurality of die from the diesource to the receive substrate is configured to occur multiple die at atime.
 24. The method of claim 19 wherein a transfer process fortransferring the plurality of die from the die source to the receivesubstrate includes at least one of an ablative process, a blisteringprocess, a thermal release process, and a surface morphology changeprocess for a surface of the die release material.
 25. The method ofclaim 19 wherein the carrier includes a laser transmissive substrate forsupporting a reactive layer and an adhesive layer.
 26. The method ofclaim 19 wherein the carrier is a flexible freestanding carrier.